JPS63197380U - - Google Patents
Info
- Publication number
- JPS63197380U JPS63197380U JP8846187U JP8846187U JPS63197380U JP S63197380 U JPS63197380 U JP S63197380U JP 8846187 U JP8846187 U JP 8846187U JP 8846187 U JP8846187 U JP 8846187U JP S63197380 U JPS63197380 U JP S63197380U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- solder
- substrate
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 230000001678 irradiating effect Effects 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
Landscapes
- Welding Or Cutting Using Electron Beams (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8846187U JPS63197380U (en]) | 1987-06-08 | 1987-06-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8846187U JPS63197380U (en]) | 1987-06-08 | 1987-06-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63197380U true JPS63197380U (en]) | 1988-12-19 |
Family
ID=30946584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8846187U Pending JPS63197380U (en]) | 1987-06-08 | 1987-06-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63197380U (en]) |
-
1987
- 1987-06-08 JP JP8846187U patent/JPS63197380U/ja active Pending